Plasma-assisted Manufacturing

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450 mm

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Plasma-assisted Manufacturing

Definition

450 mm refers to a standardized wafer size used in semiconductor manufacturing, specifically for the fabrication of integrated circuits. This size has gained importance as it allows for increased productivity and efficiency in the manufacturing process, as larger wafers can accommodate more chips, reducing production costs per chip and enhancing overall yield.

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5 Must Know Facts For Your Next Test

  1. The transition to 450 mm wafers is aimed at reducing production costs by enabling manufacturers to produce more chips per wafer compared to smaller sizes like 300 mm.
  2. The 450 mm wafer size has become increasingly relevant as semiconductor technology continues to advance, necessitating larger substrates for complex designs.
  3. Several leading semiconductor companies have invested in research and development to optimize processes specifically for 450 mm wafer fabrication.
  4. Implementing 450 mm technology requires significant updates to existing manufacturing facilities, including new equipment and processes tailored for the larger size.
  5. The adoption of 450 mm wafers is expected to contribute to a significant increase in the overall yield of functional chips during production.

Review Questions

  • How does the use of 450 mm wafers impact the economics of semiconductor manufacturing?
    • The adoption of 450 mm wafers significantly impacts the economics of semiconductor manufacturing by allowing companies to produce more chips from a single wafer. This increased density translates to lower production costs per chip, which is crucial in a highly competitive market. Furthermore, with improved yield rates, manufacturers can enhance their profit margins while meeting the growing demand for smaller and more powerful electronic devices.
  • Discuss the technical challenges associated with transitioning from smaller wafer sizes to 450 mm wafers in fabrication processes.
    • Transitioning from smaller wafer sizes to 450 mm wafers presents several technical challenges in fabrication processes. These challenges include developing new lithography techniques that can handle the larger surface area, ensuring uniformity in chemical processes across the increased diameter, and upgrading existing equipment to accommodate the new size. Additionally, optimizing material handling and processing times becomes crucial to maintain efficiency and yield during this transition.
  • Evaluate the potential long-term effects of widespread adoption of 450 mm technology on the semiconductor industry and its global supply chain.
    • Widespread adoption of 450 mm technology could have profound long-term effects on the semiconductor industry and its global supply chain. As manufacturers achieve higher yields and lower costs per chip, this could lead to increased competition and innovation in microelectronics, driving down prices for consumers. However, it may also create barriers for smaller companies unable to invest in the necessary infrastructure. Furthermore, this shift could reshape supply chains by favoring firms that adopt this technology early, potentially leading to consolidations or partnerships among major players seeking to capitalize on economies of scale.
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