Thermoelectric devices convert heat to electricity or vice versa. They use temperature differences to generate power or electrical input to create cooling. These devices rely on special semiconductors that move heat and electricity in useful ways.
Energy conversion in thermoelectric systems follows key principles. The Seebeck and Peltier effects drive power generation and cooling. Efficiency depends on material properties and operating conditions, with the ZT figure of merit indicating performance.
Thermoelectric Devices
Fundamental Components and Types
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Thermoelectric generator (TEG) converts thermal energy directly into electrical energy using temperature differences
Thermoelectric cooler (TEC) uses electrical energy to create a temperature difference, enabling cooling or heating
Thermoelectric module consists of multiple thermoelectric couples connected electrically in series and thermally in parallel
N-type and P-type semiconductors form the basic building blocks of thermoelectric devices
N-type semiconductors have excess electrons as charge carriers
P-type semiconductors have excess holes as charge carriers
Pairing N-type and P-type materials creates a thermoelectric couple
Operational Principles and Applications
TEGs harness the Seebeck effect to generate electricity from waste heat (industrial processes, automotive exhaust)
TECs utilize the Peltier effect for precise temperature control (portable coolers, electronics cooling)
Thermoelectric modules can operate in both power generation and cooling modes depending on the applied voltage or temperature gradient
Semiconductor doping alters electrical properties
Enhances charge carrier concentration
Optimizes thermoelectric performance (ZT figure of merit)
Energy Conversion Principles
Thermodynamic Foundations
Carnot efficiency represents the theoretical maximum efficiency of a heat engine operating between two temperatures
Calculated as η c = 1 − T c / T h η_c = 1 - T_c/T_h η c = 1 − T c / T h , where T c T_c T c is the cold reservoir temperature and T h T_h T h is the hot reservoir temperature
Sets an upper limit for thermoelectric device efficiency
Heat flux describes the rate of heat transfer per unit area
Governed by Fourier's law: q = − k ∇ T q = -k∇T q = − k ∇ T , where k k k is thermal conductivity and ∇ T ∇T ∇ T is the temperature gradient
Crucial for understanding thermal transport in thermoelectric materials
Electrical and Thermal Interactions
Electrical current flows through the thermoelectric material when a temperature gradient is applied (Seebeck effect)
Current density given by J = σ ( − ∇ V − S ∇ T ) J = σ(-∇V - S∇T) J = σ ( − ∇ V − S ∇ T ) , where σ σ σ is electrical conductivity , ∇ V ∇V ∇ V is voltage gradient, and S S S is Seebeck coefficient
Energy conversion efficiency quantifies the ratio of useful output energy to input energy
For TEGs: η = P o u t Q i n η = \frac{P_{out}}{Q_{in}} η = Q in P o u t , where P o u t P_{out} P o u t is electrical power output and Q i n Q_{in} Q in is heat input
For TECs: Coefficient of Performance (COP) = Q c P i n \frac{Q_c}{P_{in}} P in Q c , where Q c Q_c Q c is heat removed and P i n P_{in} P in is electrical power input
Thermoelectric figure of merit ZT determines device performance
Z T = S 2 σ T k ZT = \frac{S^2σT}{k} ZT = k S 2 σ T , where S S S is Seebeck coefficient, σ σ σ is electrical conductivity, T T T is absolute temperature, and k k k is thermal conductivity
Higher ZT values indicate better thermoelectric performance (current commercial materials achieve ZT ≈ 1)