2.4 Thermal and electrical properties of materials
5 min read•august 16, 2024
Thermal and electrical properties of materials play a crucial role in countless applications. From heat sinks in electronics to superconductors in MRI machines, these properties determine how materials behave under various conditions and how they can be used in different technologies.
Understanding the mechanisms behind thermal and helps engineers design better materials. By manipulating atomic structure, composition, and processing, we can create materials with tailored properties for specific needs, from high-performance electronics to energy-efficient buildings.
Thermal and Electrical Properties of Materials
Fundamental Concepts
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Thermal properties encompass heat capacity, , , and
Electrical properties include electrical conductivity, , , and
Electronic band structure (, semiconductors, and ) determines electrical properties
intrinsically links thermal and electrical properties for metals
Temperature dependence affects both thermal and electrical characteristics
Anisotropy in crystalline materials leads to directional variations in properties
Example: Graphite exhibits higher thermal and electrical conductivity along basal planes compared to perpendicular direction
Heat capacity measures material's ability to store thermal energy
(J/kg·K) quantifies energy required to raise temperature of unit mass by one degree
Thermal conductivity (W/m·K) represents material's ability to conduct heat
High in metals (copper ~400 W/m·K)
Low in insulators (air ~0.024 W/m·K)
Electrical conductivity (S/m) measures material's ability to conduct electric current
Ranges from high values in metals (copper ~5.96 × 10^7 S/m) to low values in insulators (glass ~10^-11 S/m)
Material Classification and Property Relationships
Metals typically exhibit high thermal and electrical conductivity due to free electron movement
Semiconductors have intermediate conductivity, controllable through doping
Silicon conductivity can be varied from ~10^-4 to 10^3 S/m through doping
Insulators possess low thermal and electrical conductivity
Ceramics like alumina used as electrical insulators and
Polymers generally have low thermal and electrical conductivity
Exception: (polyaniline) can achieve conductivities up to 10^3 S/m
Composite materials combine properties of constituent materials
Carbon fiber reinforced polymers offer high strength-to-weight ratio and tailored conductivity
Mechanisms of Heat Transfer and Electrical Conductivity
Heat Transfer Mechanisms
Conduction occurs through direct contact between particles
Dominant in solids
Fourier's law describes heat flux: q=−k∇T
Where q is heat flux, k is thermal conductivity, and ∇T is temperature gradient
Convection involves fluid motion and heat transfer between a surface and moving fluid
Newton's law of cooling: q=h(Ts−Tf)
Where h is convective heat transfer coefficient, T_s is surface temperature, and T_f is fluid temperature
Radiation transfers heat through electromagnetic waves
Stefan-Boltzmann law: q=ϵσ(T14−T24)
Where ε is emissivity, σ is Stefan-Boltzmann constant, T1 and T2 are absolute temperatures of bodies
In solids, thermal conduction occurs through lattice vibrations (phonons) and free electron movement
Metals conduct heat primarily through free electrons
Ceramics and polymers rely more on phonon conduction
Electrical Conductivity Mechanisms
Electrical conductivity in metals facilitated by free electron movement in
describes electron transport: σ=mne2τ
Where σ is conductivity, n is electron density, e is electron charge, τ is relaxation time, m is electron mass
Semiconductors conduct through electrons and holes
Concentration affected by doping and temperature
: ni=NcNve−Eg/2kT
Where Nc and Nv are effective densities of states, Eg is band gap, k is Boltzmann constant, T is temperature
describes total resistivity as sum of various scattering mechanisms
ρtotal=ρthermal+ρimpurity+ρdefect
occurs below critical temperature with zero electrical resistance
BCS theory explains electron pairing mechanism in conventional superconductors
Material Structure and Properties Relationship
Atomic and Crystal Structure Effects
Crystal structure and atomic bonding significantly influence thermal and electrical properties
metals (copper, aluminum) generally have higher conductivity than metals (iron)
Point defects, dislocations, and grain boundaries act as scattering centers
Reduce both thermal and electrical conductivity
Grain boundary scattering becomes dominant in nanocrystalline materials
Alloying elements and impurities alter thermal and electrical properties
Solid solution strengthening in alloys typically decreases conductivity
Example: Adding 2% copper to aluminum reduces electrical conductivity by ~40%
exhibit unique behaviors due to quantum confinement and increased surface area
show size-dependent electronic properties
Nanowires can have ballistic electron transport, increasing conductivity
Composite and Complex Materials
Composite materials engineered for tailored thermal and electrical properties
Rule of mixtures provides first-order approximation for properties
Pc=VfPf+(1−Vf)Pm
Where Pc is composite property, Vf is volume fraction of filler, Pf and Pm are properties of filler and matrix
Phase transitions lead to abrupt changes in thermal and electrical properties
Martensitic transformation in steel alters electrical resistivity
Curie temperature in ferromagnetic materials affects thermal properties
Crystallinity in polymers impacts thermal and electrical characteristics
Higher crystallinity increases thermal conductivity and electrical resistivity
Semi-crystalline polymers (polyethylene) have higher thermal conductivity than amorphous polymers (polystyrene)
Impact of Properties on Material Performance
Electronic and Energy Applications
Thermal management in electronics relies on high thermal conductivity materials
Heat sinks often made of aluminum or copper
(TIMs) crucial for heat dissipation
Example: Graphene-based TIMs with thermal conductivity >1000 W/m·K
characterized by figure of merit ZT
ZT=kσS2T
Where σ is electrical conductivity, S is , T is temperature, k is thermal conductivity
Bismuth telluride (Bi2Te3) widely used in thermoelectric coolers
with high breakdown strength essential for capacitors and insulation
Ceramic capacitors use materials like barium titanate (BaTiO3)
Polymeric insulators (polyethylene) used in high-voltage power transmission
Aerospace and Advanced Technology
Thermal barrier coatings in gas turbines use low thermal conductivity materials
Yttria-stabilized zirconia (YSZ) common coating material
Thermal conductivity ~2 W/m·K, compared to ~22 W/m·K for bulk zirconia