20.1 Silicon photonics and on-chip optical interconnects
3 min read•august 7, 2024
combines optical and electronic components on a single chip, revolutionizing data communication. This game-changing tech uses platforms to create compact, high-performance devices like waveguides, modulators, and photodetectors.
() take it further, packing multiple components onto one chip. This shrinks size, power use, and cost. Plus, silicon photonics plays nice with standard manufacturing processes, making it a promising solution for future computing and communication needs.
Silicon Photonics Components
Silicon-on-Insulator (SOI) Platform
Silicon-on-insulator () consists of a thin layer of silicon on top of an insulating layer (typically silicon dioxide) on a silicon substrate
SOI provides a high refractive index contrast between the silicon layer and the insulator, enabling tight confinement of light
Enables the fabrication of compact and high-performance photonic devices
SOI wafers are commercially available and compatible with standard CMOS manufacturing processes (300 mm wafers)
Waveguides and Optical Modulators
Silicon waveguides guide light on the SOI platform with low loss and tight bends
Typical dimensions are around 220 nm thick and 500 nm wide for single-mode operation at telecom wavelengths (1550 nm)
Optical modulators control the phase, amplitude, or polarization of light in the waveguide
Modulators can be based on the plasma dispersion effect, where the refractive index of silicon changes with the concentration of free carriers (electrons and holes)
Examples of silicon modulators include Mach-Zehnder interferometers (MZIs) and microring resonators
Photodetectors and Optical Multiplexing
Photodetectors convert optical signals into electrical currents
(Ge) is often integrated on SOI for photodetection due to its strong absorption at telecom wavelengths
Ge photodetectors can be fabricated using epitaxial growth or wafer bonding techniques
combines multiple optical signals into a single waveguide using () or ()
WDM uses different wavelengths for each signal, while MDM uses different spatial modes in a multimode waveguide
Photonic Integrated Circuits
Integration and Fabrication
Photonic integrated circuits (PICs) combine multiple photonic components on a single chip
PICs enable complex optical systems with reduced size, power consumption, and cost compared to discrete components
Silicon photonics PICs are fabricated using standard CMOS manufacturing processes, leveraging the existing infrastructure and economies of scale of the electronics industry
allows the integration of photonic and electronic components on the same chip
Optical Transceivers and CMOS Compatibility
Optical transceivers convert electrical signals to optical signals (transmitters) and vice versa (receivers)
Silicon photonics enables the integration of high-speed optical transceivers for data communication applications (data centers, high-performance computing)
Transceivers typically include lasers, modulators, photodetectors, and driver/receiver electronics
CMOS compatibility allows the integration of photonic devices with advanced electronic circuits (28 nm, 14 nm nodes) for improved performance and functionality
On-Chip Optical Communication
Optical Interconnects
use light for data communication between different parts of a chip or between chips
On-chip optical interconnects can overcome the bandwidth and power limitations of electrical interconnects at high data rates (>10 Gbps)
Optical interconnects consist of silicon waveguides, modulators, and photodetectors integrated with electronic circuits
Examples include chip-to-chip interconnects, memory interfaces, and network-on-chip architectures
Optical Routing and Switching
directs light signals between different endpoints on a chip or between chips
Optical switches control the path of light based on external control signals
Examples of optical switches include switches, microring switches, and
Optical routing can be used for reconfigurable interconnects, programmable photonic circuits, and optical circuit switching in data centers